Tender for SUPPLY OF HARDWARE INCLUDING SWITCHES (BOTH LAYER 2 & LAYER 3) AND SFP MODULES
Category:Archives
Post Date: 30-June-2022
Tender for SUPPLY OF HARDWARE INCLUDING SWITCHES (BOTH LAYER 2 & LAYER 3) AND SFP MODULES
Bid Submission Start Date: 30/06/2022
Pre-Bid Conference: 06-07-2022 (11:30 A.M.)
Reply to Queries: 07-07-2022
Last Date of bid submission: 11-07-2022 (15.00 HRS)
Date of bid opening & Evaluation : 11-07-2022 (15.30 HRS)
Issue of PO: 20/07/2022
You are requested to submit your physical copy of bids at address mention below.
National Internet Exchange of India
9th Floor, B-wing, Statesman House, 148, Barakhambha Road,
New Delhi-110001
Tel. : +91-11-48202000
In case of any query, you may contact Shri Abhishek Gautam – Manager (Technical) on Phone Number +91-11-48202000 or through his e-mail, abhishek.gautam@nixi.in before the meeting.
Please submit bids on or before date and time mention in Tender.
