SUPPLY OF HARDWARE INCLUDING SWITCHES (BOTH LAYER 2 & LAYER 3) AND SFP MODULES


Category:Tender

Post Date: 22-Nov-2022

SUPPLY OF HARDWARE INCLUDING SWITCHES (BOTH LAYER 2 & LAYER 3) AND SFP MODULES
Bid Start Date: 22-11-2022
Last Date of bid submission: 02-12-2022 (3:00 P.M)
Bid opening & Evaluation : 02-12-2022 (3:30 P.M)
You are requested to submit your physical copy of bids at address mention below.
National Internet Exchange of India
9th Floor, B-wing, Statesman House, 148, Barakhambha Road,
New Delhi-110001
Tel. : +91-11-48202000

In case of any query, you may contact Shri. Soumen Bhowmik by Phone Number +91-11-48202000 or through his e-mail, soumen@nixi.in before the meeting.
Please submit bids on or before date and time mention in Tender.

☞ Download Tender 

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